Boards & Modules

The focus of this paper is a combined electrical, thermal and optical characterization of power LED assemblies. Thermal management play important role in case of power LEDs, necessitating both physical measurements and simulation.

Controlling Automotive Electronic Emissions and Susceptibility with Proper EMI Suppression Methods

Today's technological innovation demands high performance coupled with low environmental impact. These dual requirements are driving components of the semiconductor industry which informs many global businesses and consumer lives.

"As the number of enhancements to various Hardware Description Languages (HDLs) has increased over the past year, so too has the complexity of determining which language is best for a particular design. Many designers and organizations are contemplating whether they should switch from one HDL to another. This paper compares the technical characteristics of three, general-purpose HDLs.

This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations.

This white paper discusses the many factors that affect the choice of the best EMI shielding materials for an application. These factors include: the materials used in the product's enclosure, the environment in which the product will be used, performance requirements for the shielding materials, quantity of products to be manufactured, and the preferred installation equipment.

Join us at ESC Boston, September 21-24 at the Hynes Convention Center, in Boston, MA. Expo registration is FREE, and advanced registration pricing is still available for conference packages.

A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.

For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.

High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.

The success of any consumer electronic device depends to a large extent on the appeal of the user interface (UI) and how easy the device is to use. Studies show that good cosmetic design can encourage users to explore the full range of features and often engenders the perception that a product is easier to use. So if the benefits of a great looking, easy-to-use UI are so clear, why are so many products still falling short of customer expectations? The solution lies in taking a fresh new approach a consumer electronic device UI plays. By identifying common UI functionality and implementing it in a reusable and customizable way, we can make it far easier for embedded engineers to deliver visually engaging and easy-to-use consumer electronic products.

Moving to C++ presents opportunities for higher programmer productivity. The requirements of embedded systems, however, demand that the adoption of C++ be carefully measured for the performance impact of run-time costs present in C++, but not in C. This talk suggests strategies for developers who are starting their acquaintance with C++.

As enterprises recognize the strategic importance of enabling their remote and/or mobile workforce with mobility solutions, they need to determine how to best extend their existing wireline services into the mobile environment. Today, many service providers offer converged solutions that help businesses bring together their office-based telecom solution with their mobile environment.

Ultra High Speed Internet, TV and local/long distance phone services combined into 1 superior service.

A number of options are available to facilities professionals looking to improve cooling efficiency and reduce resources consumed by their data centers. Beyond implementing basic measures such as sealing moisture out of the data center and improving air flow, aisle containment to prevent the mixing of hot and cold air stands out as a method that can dramatically reduce energy costs, minimize hot spots and improve the carbon footprint of data centers.

Flash memory is a non-volatile memory, which allows the user to electrically program (write) and erase information. The exponential growth of flash memory has made this technology an indispensable part of billions of electronic devices.

The frequency of the local oscillator is set so that the difference between the local oscillator frequency and desired input signal (the radio station you want to receive) equals the IF.