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Results 1 - 16 of 16 matches |
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Measuring the Business Value of Green Datacenters |
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Today, policy and business leaders are reaching a consensus that industry must address rising greenhouse gas (GHG) emissions. Leading enterprises are now turning to the practical challenge of determining how, how much, and at what cost to reduce emissions.
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Comparison of VHDL, Verilog and SystemVerilog |
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"As the number of enhancements to various Hardware Description Languages (HDLs) has increased over the past year, so too has the complexity of determining which language is best for a particular design. Many designers and organizations are contemplating whether they should switch from one HDL to another.
This paper compares the technical characteristics of three, general-purpose HDLs.
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Electronic Packaging: EMI Material-Based Solutions |
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This white paper discusses the many factors that affect the choice of the best EMI shielding materials for an application. These factors include: the materials used in the product's enclosure, the environment in which the product will be used, performance requirements for the shielding materials, quantity of products to be manufactured, and the preferred installation equipment.
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Free Gartner Report - The Great Virtualization Dilemma: What You Need to Know |
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Despite progress in virtualization, much development still remains. With predictions that virtualization will become pervasive, this research highlights forthcoming challenges and strategic issues facing IT planners. Register now for this free Gartner report sponsored by Dell and Intel to receive important advice on how to deal issues such as heterogeneity, resources and performance optimization, and the increasing fragmented tool market.
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Establishing Confidence in PDN Simulation |
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A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.
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Measuring the Performance of Equalized Serial Data Links Across the Design Flow |
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For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
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Power Integrity Effects of High Density Interconnect (HDI) |
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High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
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Inflexion Platform UI: A New Approach to User Interface Creation for Consumer Electronic Devices |
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The success of any consumer electronic device depends to a large extent on the appeal of the user interface (UI) and how easy the device is to use. Studies show that good cosmetic design can encourage users to explore the full range of features and often engenders the perception that a product is easier to use. So if the benefits of a great looking, easy-to-use UI are so clear, why are so many products still falling short of customer expectations? The solution lies in taking a fresh new approach a consumer electronic device UI plays. By identifying common UI functionality and implementing it in a reusable and customizable way, we can make it far easier for embedded engineers to deliver visually engaging and easy-to-use consumer electronic products.
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Using C++ Efficiently In Embedded Applications |
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Moving to C++ presents opportunities for higher programmer productivity. The requirements of embedded systems, however, demand that the adoption of C++ be carefully measured for the performance impact of run-time costs present in C++, but not in C. This talk suggests strategies for developers who are starting their acquaintance with C++.
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The Multi-tiered Hybrid Data Center |
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To accommodate increasingly dense technology environments, increasingly critical business applications, and increasingly stringent service level demands, data centers are typically engineered to deliver the highest-affordable availability levels facility-wide. Within this monolithic design approach, the same levels of mechanical, electrical, and IT infrastructure are installed to support systems and applications regardless of their criticality or business risk if unplanned downtime occurs. Typically, high redundancy designs are deployed in order to provide for all eventualities. The result, in many instances, is to unnecessarily drive up both upfront construction or retro-fitting costs and ongoing operating expenses.
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Automotive System Design and Mechatronics |
| By : IBM |
Published Date: Mar 24, 2009 |
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Electronics and Software Engineering are quickly merging with traditional Mechanical Engineering to create a new paradigm in auto manufacturing: Mechatronics. Industry experts predict that this shift will bring about profound advances in automotive product development. Unfortunately, existing IT and process infrastructures do not provide sufficient capabilities to support the new paradigm: multiple data silos, a lack of standardized processes, and integration issues on a tool level (Mechanical, Electronic, Software) continue to pose serious obstacles to development efficiency, and remain a frequent source of delays, quality issues and cost increases.
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Controlling DC Brush Motors with H-bridge Driver ICs. |
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In this paper, The reader will be introduced to ROHM’s unique product family which incorporates numerous advanced features including high-efficiency PWM outputs, integrated timing and control circuitry as well as the unique capability of handling either analog or digital (PWM) speed control inputs.
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Results 1 - 16 of 16 matches |
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More Electronics Topics |
Analog Communications, Digital Signal Processing, Electronic Design Automation, System On A Chip, Electronic Test and Measurement, Embedded Design, Boards & Modules, Embedded Systems and Networking, Electromechanical & Mechanical, Optoelectonics & Displays, Packaging and Interconnects, Passive & Discrete Components, Power Sources & Conditioning Devices, Integrated Circuits and Semiconductors, Sensors & Actuators |
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